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August 2000
FDR8321L P-Channel MOSFET With Gate Driver For Load Switch Application
General Description
This device is designed for configuration as a load switch and is particularly suited for Power Management in portable battery powered electronic equipment. Designed to operate from 2.5V to 8V input and supply up to 2.9A. The device features a small N-Channel MOSFET (Q1) together with a large P-Channel power MOSFET (Q2) in a single SuperSOTTM-8 package.
Features
VDROP = 0.2V @ VIN= 5V, IL= 2.9A. RDS(ON) = 0.070 VDROP = 0.2V @ VIN= 2.5V, IL= 2A. RDS(ON) = 0.105 . VON/OFF Zener protection for ESD ruggedness (>6KV Human Body Model). High density cell design for extremely low on-resistance.
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
SOIC-16
VOUT,C1,CO
5 6 7 8
Q2
4 3
EQUIVALENT CIRCUIT
VIN,R1,Ci
VOUT,C1,CO
R1,R2,C1
IN +
VDROP
-
OUT
R2
Q1
2 1
C1,CO
R2
VON/OFF
O N / O FF
pin 1
SuperSOT -8
TM
See Application Circuit
Absolute Maximum Ratings
Symbol Parameter
TA = 25C unless otherwise noted
FDR8321L
Units
VIN VON/OFF IL
Input Voltage Range On/Off Voltage Range Load Current @ VDROP= 0.2V - Continuous - Pulsed
(Note 1)
2.5 - 8 1.5 - 8 2.9 10
(Note 2)
V V A
PD TJ,TSTG
Maximum Power Dissipation Operating and Storage Temperature Range
0.8 -55 to 150
W C
THERMAL CHARACTERISTICS
RJA RJC
Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note 2) (Note 2)
156 40
C/W C/W
(c)2000 Fairchild Semiconductor International
FDR8321L Rev. C
Electrical Characteristics
Symbol Parameter OFF CHARACTERISTICS
(TA = 25C unless otherwise noted)
Conditions
Min
Typ
Max
Units
IFL VDROP RDS(ON) IL
Forward Leakage Current
VIN = 5 V, VON/OFF = 0 V VIN = 5 V, VON/OFF = 3.3 V, IL = 2.9 A VIN = 2.5 V, VON/OFF = 3.3 V, IL= 2 A VGS = -5 V, ID = -2.9 A VGS = -2.5 V, ID = -2 A VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 2.5 V, VON/OFF = 3.3 V 2.9 2 0.185 0.18 0.06 0.09
1
A
ON CHARACTERISTICS (Note 3)
Conduction Voltage Drop
0.2 0.2 0.07 0.105
V
Q2 - Static Drain-Source On-Resistance Load Current
A
Notes: 1. 2. VIN=5V, VON/OFF=8V, VDROP=0.2V, TA=25oC RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. RJA typical =156oC/W when mounted on a minimum 0.0025 in2 pad on FR-4. 3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%
FDR8321L Load Switch Application
APPLICATION CIRCUIT Q2
IN
R1 C1
OUT
R2
Ci
Co
LOAD
ON/OFF
Q1
External Component Recommendation First select R2, 100 - 1k, for Slew Rate control. C1 1000pF can be added in addition to R2 for further In-rush current control. Then select R1 such that R1/R2 ratio maintains between 10 - 100. R1 is required to turn Q2 off. For SPICE simulation, users can download a "FDR8321L.MOD" Spice model from Fairchild Web Site at www.fairchildsemi.com
FDR8321L Rev.C
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
0.4 0.4
TJ = 125 C
0.3 0.3
TJ = 125 C TJ = 25 C
V DROP (V)
VDROP (V)
TJ = 25 C
0.2
0.2
0.1
V IN = 5V V ON/OFF = 1.5 - 8V PW =300us, D 2%
0.1
V IN = 2.5V V ON/OFF= 1.5 - 8V PW =300us, D 2%
0
0
1
2 I L (A)
3
4
5
0
0
1
2 I L (A)
3
4
5
Figure 1. Conduction Voltage Drop versus Load Current at Input Voltage 5V.
Figure 2. Conduction Voltage Drop versus Load Current at Input Voltage 2.5V.
0.4 V DROP ,(V) or R ON ,(Ohm)
0.4 V DROP ,(V) or R ON ,(Ohm)
I L = 2.9A V ON/OFF = 1.5 - 8V PW =300us, D 2%
I L = 2A V ON/OFF = 1.5 - 8V PW =300us, D 2%
0.3
0.3
0.2
0.2
TA = 125 C
0.1
TA = 125 C
0.1
TA = 25 C
0 0 1 2 3 V IN ,(V) 4 5 1 2 3
TA = 25 C
4 5
V IN ,(V)
Figure 3. Conduction Voltage Drop versus input Voltage at Load Current 2.9A.
Figure 4. Conduction Voltage Drop versus Input Voltage at Load Current 2A.
100
V in = 5V Ci = 10uF Von/off = 3.3V R1 = 10KOhm I L = 1A C = 1uF o
50
t d(off)
40
V in = 2.5V C i = 10uF Von/off = 3.3V
R1 = 10KOhm IL = 1A Co = 1uF
80
t d(off)
Time (us)
Time (us)
60
30
tf
40
20
tf
20 10
tr t d(on)
t d(on)
0 0 0.5 1
tr
0 1.5 R2 (KOhm) 2 2.5 3 0 0.5 1 1.5 R2 (KOhm) 2
2.5
3
Figure 5. Switching Variation with R2 at Vin=5V and R1=10K .
Figure 6. Switching Variation with R2 at Vin=2.5V and R1=10K .
FDR8321L Rev.C
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
TRANSIENT THERMAL RESISTANCE 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 0.0001 0.001 0.01 0.1 t1 , TIME (sec) 1
D = 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse
r(t), NORMALIZED EFFECTIVE
R JA (t) = r(t) * R JA R JA = 156 C/W
P(pk)
t1
t2
TJ - TA = P * R JA (t) Duty Cycle, D = t 1/ t 2
10 100 300
Figure 7. Transient Thermal Response Curve.
Thermal characterization performed on the conditions described in Note 2.
FDR8321L Rev.C
SuperSOTTM-8 Tape and Reel Data and Package Dimensions
SSOT-8 Packaging Configuration: Figure 1.0
Customized Label
Packaging Description:
SSOT-8 parts are shipped in tape. The carrier tape is made from a di ssipat ive (carbo n filled) po ly carbon ate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film , adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped w ith 3,000 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 unit s per 7" or 177cm diameter reel. This and some other options are further described in the Packagin g Information table. These full reels are in di vidu ally barcod e labeled and placed inside a standard intermediate box (ill ustrated in figure 1.0) made of recyclable corrugated brow n paper. One box contains two reels maximum. And t hese boxes are placed ins ide a barcode labeled shipp ing bo x whic h comes in di fferent sizes depend in g on t he nu mber of parts shippe d.
F63TNR Label Anti static Cover Tape
Static Dissi pat ive Emboss ed Carrier Tape
F852 831N F852 831N F852 831N F852 831N F852 831N
Pin 1
SSOT-8 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard
(no f l ow c ode )
D84Z TNR 500 7" Dia 184x187x47 1,000 0.0416 0.0980
TNR 3,000 13" D ia 343x64x343 6,000 0.0416 0.5615
SSOT-8 Unit Orientation
343mm x 342mm x 64mm Intermediate box for Standar d and L99Z Opti ons
F63TNR Label
F63TNR Label
F63TNR Labe l sa mpl e 184mm x 187mm x 47mm Pizza Box fo r D84Z Option F63TNR Label
LOT: CBVK741B019 FSID: FDR835N QTY: 3000 SPEC:
SSOT-8 Tape Leader and Trailer Configuration: Figur e 2.0
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN: N/F: F
(F63TNR)3
Carrier Tape Cover Tape
Components Traile r Tape 300mm mi nimum or 38 empty pockets Lead er Tape 500mm mi nimum or 62 empty poc kets
August 1999, Rev. C
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SSOT-8 Embossed Carrier Tape Configuration: Figur e 3.0
T E1 P0
D0
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter Pkg type SSOT-8 (12mm)
A0
4.47 +/-0.10
B0
5.00 +/-0.10
W
12.0 +/-0.3
D0
1.55 +/-0.05
D1
1.50 +/-0.10
E1
1.75 +/-0.10
E2
10.25 mi n
F
5.50 +/-0.05
P1
8.0 +/-0.1
P0
4.0 +/-0.1
K0
1.37 +/-0.10
T
0.280 +/-0.150
Wc
9.5 +/-0.025
Tc
0.06 +/-0.02
Notes : A0, B0, and K0 dimensions are deter mined with r espec t to t he EIA/Jedec RS-481 rotationa l and lateral movement requi remen ts (see sketches A, B, and C).
20 deg maximum Typical component cavity center line
0.5mm maximum
B0 20 deg maximum component rotation
0.5mm maximum
Sketch A (Si de or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
SSOT-8 Reel Configuration: Figur e 4.0
Component Rotation
W1 Measured at Hub
Dim A Max
Dim A max
Dim N
See detail AA
7" Diameter Option
B Min Dim C See detail AA W3
Dim D min
13" Diameter Option
W2 max Measured at Hub DETAIL AA
Dimensions are in inches and millimeters
Tape Size
12mm
Reel Option
7" Dia
Dim A
7.00 177.8 13.00 330
Dim B
0.059 1.5 0.059 1.5
Dim C
512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2 0.795 20.2
Dim N
5.906 150 7.00 178
Dim W1
0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0
Dim W2
0.724 18.4 0.724 18.4
Dim W3 (LSL-USL)
0.469 - 0.606 11.9 - 15.4 0.469 - 0.606 11.9 - 15.4
12mm
13" Dia
(c) 1998 Fairchild Semiconductor Corporation
July 1999, Rev. C
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SuperSOTTM-8 (FS PKG Code 34, 35)
1:1
Scale 1:1 on letter size paper
Di mensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.0416
September 1998, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DOMETM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R)
DISCLAIMER
FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM POPTM PowerTrench(R)
QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM
VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. F1

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